Micron, 3D Nand & mobile memory demand

I thought this was interesting! In case anyone is any doubt of Micron’s 64 layer, second generation 3D Nand technology or the demand potential in mobile memory with the prediction of AI on 80% of smartphone devices by 2022!


BARCELONA, Spain, Feb. 26, 2018 (GLOBE NEWSWIRE) – Micron Technology, Inc. (MU) announced today three new 64-layer, second-generation 3D NAND storage products, which support the high-speed Universal Flash Storage (UFS) 2.1 standard. Micron’s new mobile 3D NAND products are available in 256GB, 128GB and 64GB capacities.

These new mobile solutions are based on Micron’s industry-leading triple level cell (TLC) 3D NAND technology, empowering smartphone makers to enhance the user experience with next-generation mobile features such as artificial intelligence (AI), virtual reality and facial recognition. The emergence of AI in flagship phones is driving the need for more advanced storage solutions that enable faster and more efficient access to data. Analyst firm Gartner predicts that by 2022, 80 percent of all smartphones will have on-device AI capabilities, increasing the requirement to process and store more data locally.1