From SA today - AEHR has secured initial orders for multiple high-power FOX-XP™ wafer-level test and burn-in systems and WaferPak™ contactors from its first artificial intelligence customer
- The first system will ship immediately, with all shipments of the systems and initial product WaferPaks completing within 90 days by February 28, 2025.
- “This latest turnkey solution from Aehr enables a first-ever ability to do a cost-effective production test and burn-in of high-power devices such as AI accelerators at the wafer level with temperatures reaching up to 150 degrees Celsius. This process enables a significant cost saving and yield improvement with the detection and elimination of early life failures during the production process while the devices are still in wafer form, before they are assembled into modules or systems,” said Gayn Erickson, President and CEO of Aehr Test Systems.
- “Aehr Test Systems is the only company in the world that can now offer both wafer-level and package-level turnkey test and burn-in solutions for these AI processors,” he added.