TSMC has started producing chips at its Fab 21 near Phoenix, Arizona, using its 4nm-class process technology, Commerce Secretary Gina Raimondo told Reuters. This marks the first time such a cutting-edge production node has been manufactured in the United States. The confirmation from a high-ranking official comes months after the first unofficial information emerged that the fab was mass-producing chips for Apple.
TSMC has said before that they plan to keep their most advanced technology in Taiwan. But investors worry about China and possible new tariffs, etc. Diversification is reassuring. One would hope the latest techniques could be moved to Arizona promptly if the need arises.
Interesting situation. Intel made mistakes in equipping its plants and in marketing its foundry services. TSMC could probably assist with marketing but re-equipping plants looks doubtful. You wonder how much difference this could make. But they are unlikely to do worse than Intel mgt.
Hang on there Cochise. Is Trump talking about seizing Intel’s plants, and turning them over to a company he likes better? How big a check does he stand to pocket for this one?
Who owns the plants? Do companies have property rights now, or is it all about who buys favor from TIG? This isn’t the only instance I have heard of recently. Reportedly, a newly elected pol from Ohio is pushing to have the government force Stellantis to spin off the former Chrysler Corp units.
Intel is behind TSMC, but not that far behind. The “latest” tech is EUV. According the ChapGPT here are lists of each TSMC and Intel FABs with and without EUV machines
Fab
Location
EUV Capability
D1X
Hillsboro, Oregon, USA
Yes
Fab 12
Chandler, Arizona, USA
Yes
Fab 22
Chandler, Arizona, USA
Yes
Fab 28
Kiryat Gat, Israel
Yes
Fab 34
Leixlip, Ireland
Yes
Fab 42
Chandler, Arizona, USA
Yes
Fab 52
Chandler, Arizona, USA
Yes (under construction)
Fab 62
Chandler, Arizona, USA
Yes (under construction)
Fab 11X
Rio Rancho, New Mexico, USA
No
Fab 24
Leixlip, Ireland
No
Fab 32
Chandler, Arizona, USA
No
Fab 38
Kiryat Gat, Israel
No
Fab 27
Licking County, Ohio, USA
No (under construction)
SC2
Santa Clara, California, USA
No
Pelican
Penang, Malaysia
No (under construction)
Fab 29
Magdeburg, Germany
No (under construction)
Intel’s EUV capabilities are primarily concentrated in their advanced fabs in the USA, Israel, and Ireland
TSMC FABs
Fab
Location
EUV Capability
Fab 12
Hsinchu, Taiwan
Yes
Fab 14
Tainan, Taiwan
Yes
Fab 15
Taichung, Taiwan
Yes
Fab 18
Tainan, Taiwan
Yes
Fab 16
Nanjing, China
No
TSMC Arizona
Phoenix, USA
Yes (under construction)
Fab 3
Hsinchu, Taiwan
No
Fab 5
Hsinchu, Taiwan
No
Fab 6
Tainan, Taiwan
No
Fab 8
Hsinchu, Taiwan
No
Fab 10
Shanghai, China
No
Fab 11
Camas, USA
No
Fab 2
Hsinchu, Taiwan
No
Advanced Backend Fab 1
Hsinchu, Taiwan
No
Advanced Backend Fab 2
Tainan, Taiwan
No
Advanced Backend Fab 3
Taoyuan, Taiwan
No
Summary:
TSMC has 5 fabs with EUV out of a total of 16.
Intel has 8 fabs with EUV out of a total of 15.
Intel is at least 2 years behind in the best process node (highest density)
If EUV is not required for many of the chips produced by TSMC, then it is no big deal. Remember: TSMC is a contract manufacturer whereas Intel mostly does its own chip fabrication.
I think in 2022 Taiwan Semi gave up some IP for Intel to work on 1.8 nm. In return some of the Chips act goes to TSM. Now this admin wants credit for things.
Intel’s 1.8 nm (18A) process is expected to enter mass production in mid-2025. However, some reports indicate that the process isn’t ready for high-volume production yet.
What’s the status?
Intel has sampled 18A-based products with customers.
Intel has reported that it has a dozen customers using its 18A tool kit.
Microsoft has contracted Intel for $15 billion to use the 18A process.
Broadcom has tested Intel’s 18A node on its internal designs, but found that it’s not ready for high-volume production.
What’s the plan?
Intel’s 18A process is intended to help Intel regain technology leadership.
Intel’s 14A process is planned to begin production around 2027.
What’s the competition?
TSMC’s N2 node is slated for high-volume manufacturing in late 2025.
Samsung’s SF2 is expected to enter high-volume manufacturing in 2025.